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Component Tape & Reel |
Prepares components of all types for auto-insertion on circuit
boards during assembly. Pyramid Technologies Inc. provides tape
and reel services for both SMD (surface mount device) and leaded
(axial and radial) components. All tape and reel services conform
to EIA standards. |
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Surface Mount
Devices (SMD) |
Package types supported: SOIC, SOJ, PLCC, TSOP and BGA. Daily
capacity (# of pieces): 50,000 - 200,000 based on component type.
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Axial and Radial |
Package types supported: Daily capacity 10,000 - 20,000 based on
component type. |
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Bar Coding |
Supports all industry-standard bar codes and label sizes. Labeling
conforms to EIA-566-A standards and includes code 39 for reels,
trays, bags, components, PCBs and modules. |
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Dry Packing &
Packaging |
Reels,
tubes and trays containing components can be vacuum-sealed inside
a moisture barrier bag to prevent humidity from damaging sensitive
devices. Dry packing components can give them a moisture-free
shelf life of 1-2 years depending upon storage conditions. |
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Component
Programming |
Programming of most semiconductors and electronic components as
long as the part is a programmable device. Daily capacity for
programming is based upon varying programming cycles. Packages
supported include EPROM, EEPROM, PLD, GAL, PAL and Flash in over
7,000 different devices. |
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Lead Inspection,
Repair, Forming & Trimming |
Lead
inspection and repair for most ICs and CPUs in most packages and
sizes. Lead forming and trimming for radial and axial devices.
100% visual inspection on each component. Forms available are:
standoff, lock-in, spread and 90º bend. Custom forms are also
available. Call for details. |
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Microprocessor
(CPU) Testing & Verification |
Microprocessors can be tested to verify functionality and
authenticity. Testing and verification reduces worries about
counterfeit, defective and remarked microprocessors and protects
the OEM and Distributor customer. Tests performed include
packaging and functionality tests as well as "remark tests."
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Memory Testing &
Verification |
Memory
products can be tested to verify that they are functioning
completely within specifications. |
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Memory
Components |
Components supported: DRAM, SRAM, Flash and Pseudostatic RAM.
Package types: SOJ and TSOP.
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Memory Modules |
Modules supported: SIMMs, DIMMs, Notebook Modules and Memory
Cards. Module sizes: SIMM - 30 and 72 pin; DIMM - 72, 144 & 168
pin. |
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Hard Drive
Diagnostics |
Complete diagnostic testing for hard drives. The actual platters
(disks) are tested for errors and reliability, as are the
read/write heads. Hard drives supported: all IDE and SCSI Hard
Drives. |
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Floppy Drive
Testing |
Complete diagnostic testing for all floppy drives. The read/write
heads and controllers are tested for functionality and accuracy.
Floppy drives supported: 1.44MB floppy drives for PCs and
notebooks. |
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CD-ROM Drive
Testing |
Complete diagnostic testing for CD-ROM drives. Drives are tested
for read/write functionality as well as multimedia capabilities.
Drives supported: all CD-ROM drives, all speeds. |
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Board Level Testing |
Diagnosis and testing of all motherboards and computer cards
required to make a PC function properly. Ensures that all
components on a board function and that the board/card performs
according to manufacturer specs. Test reports are attached to the
product or shipment. All system boards supported, including
motherboards, video cards, audio cards, I/O cards, etc.
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